Semiconductor laser and a method for producing the same

ABSTRACT

A semiconductor laser device according to the present invention includes: a semiconductor substrate having a first conductivity type; and a semiconductor multilayer structure provided on the semiconductor substrate, the semiconductor multilayer structure including an active layer. The semiconductor multilayer structure includes: a lower cladding layer provided below the active layer, the lower cladding layer having the first conductivity type; an upper cladding structure provided above the active layer, the upper cladding structure having a second conductivity type; and a cap layer provided above the upper cladding structure. A ridge is formed in the upper cladding structure, and a width of a lower face of the cap layer is larger than a width of an upper face of the ridge.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of patent application Ser. No.08/785,242, filed Jan. 17, 1997, now U.S. Pat. No. 5,956,361.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a highly reliable semiconductor laserand a method for producing the same which requires relatively smallpower consumption.

2. Description of the Related Art

Various techniques have been explored for providing a highly reliablesemiconductor laser which requires relatively small power consumption.For example, Japanese Laid-Open Patent Publication No. 5-160503discloses semiconductor laser device having a ridge guide structure of aso-called actual refractive index guide type.

Referring to FIG. 8, the above-mentioned conventional semiconductorlaser is described. This semiconductor laser includes an n-GaAs bufferlayer 202 (thickness: about 0.5 μm), an n-Al₀.5 Ga₀.5 As lower claddinglayer 203 (thickness: about 1 μm), an n-Al₀.15 Ga₀.85 As active layer204 (thickness: about 0.07 μm), a p-Al₀.5 Ga₀.5 As upper cladding layer221 (thickness: about 1 μm in a ridge portion and about 0.15 μm inregions other than the ridge), a p-GaAs cap layer 208 (thickness: about0.2 μm), an n-Al₀.65 Ga₀.35 As current blocking layer 209 (thickness:about 0.5 μm), an n-GaAs protection layer 220 (thickness: about 0.5 μm),and a p-GaAs contact layer 212 (thickness: about 3 μm) formed on ann-GaAs substrate 201. A ridge 213 is formed in the upper cladding layer221.

Hereinafter, a method for producing the above-mentioned conventionalsemiconductor laser is described with reference to FIGS. 9A to 9D.

First, in the first stage of semiconductor layer crystal growth shown inFIG. 9A, the n-GaAs buffer layer 202, the n-Al₀.5 Ga₀.5 As lowercladding layer 203, the Al₀.15 Ga₀.85 As active layer 204, the p-Al₀.5Ga₀.5 As upper cladding layer 221, and the p-GaAs cap layer 208 aresequentially formed on the n-GaAs substrate 201 (Step A).

Next, as shown in FIG. 9B, a dielectric film 216 (e.g., nitride orsilicon oxide film) is formed in a striped shape on the p-GaAs cap layer208. By using the dielectric film 216 as a mask, the p-GaAs cap layer208 and the p-Al₀.5 Ga₀.5 As upper cladding layer 221 are partiallyetched away, thereby leaving a ridge 213 (Step B).

Next, in the second stage of semiconductor layer crystal growth shown inFIG. 9C, by using the dielectric film 216 again as a mask, the n-Al₀.65Ga₀.35 As current blocking layer 209 and the n-GaAs protection layer 220are-selectively grown so as to be present only on the side faces of thep-GaAs cap layer 208 and on the p-Al₀.5 Ga₀.5 As upper cladding layer221 by MOCVD (metal organic chemical vapor deposition) (Step C).

Next, as shown in FIG. 9D, the dielectric film 216 is removed. In athird stage of semiconductor layer crystal growth, the p-GaAs contactlayer 212 is formed so as to cover all of the portions of the p-GaAs caplayer 208, the n-Al₀.65 Ga₀.35 As current blocking layer 209, and then-GaAs protection layer 220 that are exposed on the surface (Step D).

Finally, an electrode is formed on each of the n-GaAs substrate 201 andthe p-GaAs contact layer 212 to complete the semiconductor laser. Theabove-described conventional semiconductor laser achieves laseroscillation by confining light and an electric current in a region belowthe Al₀.15 Ga₀.85 As active layer 204.

As described above, the above conventional semiconductor laser has aridge guide structure where a portion of the p-Al₀.5 Ga₀.5 As uppercladding layer 221 defines the ridge 213. At Step B, the p-Al₀.5 Ga₀.5As upper cladding layer 221 is inevitably exposed to the atmosphereafter the formation of the ridge 213. In general, a portion of an AlGaAslayer exposed to the atmosphere forms a deep energy level because of itsAl content, which is an element relatively susceptible to oxidation.This causes the AlGaAs layer to absorb some light, thereby degrading thereliability of the semiconductor laser. In contrast, in theabove-mentioned conventional semiconductor laser, the portion which wasactually exposed to the atmosphere is located at a certain distance fromthe active region thereof, so that the unfavorable light absorptionoccurring in such exposed portions is substantially reduced. Thus, theabove-mentioned conventional semiconductor laser attains a highreliability.

Moreover, the conventional semiconductor laser confines light along thehorizontal direction only in terms of the actual refractive index, i.e.,by providing the n-Al₀.65 Ga₀.35 As current blocking layer 209 (having asmaller refractive index than that of the p-Al₀.5 Ga₀.5 As uppercladding layer 221) on the outside of the ridge 213 of the p-Al₀₅ Ga₀.5As upper cladding layer 221. Since this structure (often referred to asthe "actual refractive index guide type structure") attains thehorizontal confinement of light without utilizing light absorption, itcan reduce the propagation loss during laser oscillation, which in turnreduces the power consumption of the laser.

In the above-mentioned method for producing a conventional semiconductorlaser device, the dielectric film 216 is layered above the ridge 213during the step of forming the ridge 213. During the subsequent MOCVDgrowth, the n-Al₀.65 Ga₀.35 As current blocking layer 209 and the n-GaAsprotection layer 220 are selectively formed only in regions other thanin the dielectric film 216. As a result, the n-Al₀.65 Ga₀.35 As currentblocking layer 209 and the n-GaAs protection layer 220 are preventedfrom being formed on the ridge 213 during the second crystal growth.

Moreover, the n-Al₀.65 Ga₀.35 As current blocking layer 209 and then-GaAs protection layer 220 of the conventional device are formed duringthe second crystal growth. Although the n-Al₀.65 Ga₀.35 As currentblocking layer 209 would suffice to confine light and an electriccurrent, the n-GaAs protection layer 220 ensures that GaAs (which isrelatively immune to oxidation) extends over a large region of thesurface of the device before the third crystal growth. Thus, thecrystallinity of the p-GaAs contact layer 212 formed through the thirdcrystal growth improves as compared with the case where the n-GaAsprotection layer 220 is not provided.

HF (hydroxy fluoride) is generally used for etching away the dielectricfilm 216. In the conventional semiconductor laser device, the n-GaAsprotection layer 220 provided on the n-Al₀.65 Ga₀.35 As blocking layer209 makes it possible to use HF for etching away the dielectric film216. Specifically, HF is capable of etching an Al_(x) Ga_(1-x) As layerwhere x is equal to or larger than 0.4 at a fast etching rate, but then-GaAs protection layer 220 prevents the n-Al₀.65 Ga₀.35 As currentblocking layer 209 from being etched during the process of etching thedielectric film 216.

However, the inventors of the present invention attempted producing theabove-described conventional semiconductor laser device and tested itsoperation, which revealed a number of problems which are describedbelow.

Firstly, the aforementioned conventional semiconductor laser devicerequires a higher driving voltage than those of lasers of otherstructures existing prior to this device. A study by the presentinventors revealed that the crystallinity of the p-GaAs contact layer212 in regions where it comes in contact with the n-Al₀.65 Ga₀.35 Ascurrent blocking layer 209 deteriorates so that such regions becomehighly resistive.

More specifically, in the aforementioned conventional semiconductorlaser, the n-Al₀.65 Ga₀.35 As current blocking layer 209 and the n-GaAsprotection layer 220 are formed during the second crystal growth,thereby ensuring that a large region of the surface of the device beforethe third crystal growth is GaAs (which is relatively immune tooxidation) so as to improve the crystallinity of the p-GaAsa contactlayer 212 formed through the third crystal growth. However, a certainwidth of n-Al₀.65 Ga₀.35 As current blocking layer 209 is present oneach side of the p-GaAs cap layer 208 (defining part of the ridge) onthe surface of the laser device prior to the third crystal growth. Inthe aforementioned semiconductor laser device produced by the presentinventors, the width of the above-mentioned portion (appearing on eachside of the p-GaAs cap layer 208 on the surface) of the n-Al₀.65 Ga₀.35As current blocking layer 209 was about 0.47 μm, which is only slightlysmaller than the thickness (about 0.5 μm) of the portions of then-Al₀.65 Ga₀.35 As current blocking layer 209 present above the p-Al₀.5Ga₀.5 As upper cladding layer 221 in regions other than the ridge. Owingto the oxidation of the Al content in the n-Al₀.65 Ga₀.35 As currentblocking layer 209, the crystallinity of the region of the p-GaAscontact layer 212 (formed through the third crystal growth) on then-Al₀.65 Ga₀.35 As current blocking layer 209 may deteriorate, therebyincreasing the resistivity of the region. Since an electric currentconcentrates in the portion of the p-GaAs contact layer 212 adjacent tothe ridge, any increase in resistivity has a large undesired influencein this region, thereby substantially increasing the driving voltage ofthe semiconductor laser.

Moreover, the n-GaAs protection layer 220 of the aforementionedconventional semiconductor laser, which is provided on the n-Al₀.65Ga₀.35 As current blocking layer 209, is intended to prevent then-Al₀.65 Ga₀.35 As current blocking layer 209 from being etched duringthe process of etching the dielectric film 212 with HF. However, then-Al₀.65 Ga₀.35 As current blocking layer 209 is still susceptible toetching by HF in the regions appearing on both sides of the p-GaAs caplayer 208 at the ridge. If the n-Al₀.65 Ga₀.35 As current blocking layer209 is overly etched, the semiconductor laser may not oscillate.

Secondly, the aforementioned conventional semiconductor laser device hasa short life under continuous operation. This problem may be caused bydislocations occurring within the device, which are presumably caused bythe use of a nitride film in the production process. Specifically, theproduction of the conventional semiconductor laser involves an MOCVDselective growth, which utilizes the dielectric film 216 formed on thep-GaAs cap layer 208. The MOCVD selective growth is generally conductedat a temperature from about 650° C. to about 800° C. If a dielectricfilm formed on a semiconductor layer is exposed to such a hightemperature, the semiconductor layer experiences a large amount ofstress owing to the difference in the thermal expansion coefficientbetween the semiconductor layer and the dielectric film, therebyallowing a large number of dislocations to be generated. In general, thereliability of the semiconductor laser substantially decreases as thenumber of dislocations generated in the laser emission region increases.It is contemplated that the aforementioned conventional laser deviceincludes a number of locations in the laser emission region thereof,thereby resulting in the short operation life thereof.

Thirdly, the MOCVD selective growth of the AlGaAs layer utilizing adielectric film requires a corrosive gas, e.g., HCl, to besimultaneously used, thereby making it difficult to handle and/ormaintain the MOCVD device.

SUMMARY OF THE INVENTION

In one aspect, the present invention provides a semiconductor laserdevice including: a semiconductor substrate having a first conductivitytype; and a semiconductor multilayer structure provided on thesemiconductor substrate, the semiconductor multilayer structureincluding an active layer, wherein the semiconductor multilayerstructure further includes: a lower cladding layer provided below theactive layer, the lower cladding layer having the first conductivitytype; an upper cladding structure provided above the active layer, theupper cladding structure having a second conductivity type; and a caplayer provided above the upper cladding structure, the cap layer havingthe second conductivity type, and wherein a ridge is formed in the uppercladding structure, and a width of a lower face of the cap layer islarger than a width of an upper face of the ridge.

In one embodiment of the invention, the semiconductor multilayerstructure further includes: a current blocking layer substantiallyinterposing the cap layer and the ridge on both sides, the currentblocking layer having the first conductivity type; and a protectionlayer substantially interposing the current blocking layer substantiallyon both sides.

In another embodiment of the invention, the active layer has arefractive index larger than a refractive index of the lower claddinglayer and a refractive index of the upper cladding structure, and thecurrent blocking layer has a refractive index smaller than therefractive index of the upper cladding structure.

In still another embodiment of the invention, the upper claddingstructure and the current blocking layer include Al; and the cap layerand the protection layer include zero or more Al, the cap layerincluding less Al than the upper cladding structure, and the protectionlayer including less Al than the current blocking layer.

In still another embodiment of the invention, the upper claddingstructure includes: a first upper cladding layer having the secondconductivity type; an etching stop layer having the second conductivitytype; and a second upper cladding layer having the second conductivitytype, and the ridge is substantially formed in the second upper claddinglayer.

In still another embodiment of the invention, the etching stop layerincludes a composition different from a composition of the first uppercladding layer and a composition of the second upper cladding layer.

In still another embodiment of the invention, each of side faces of thecap layer constitutes about 90° or more with respect to the lower faceof the cap layer.

In still another embodiment of the invention, each of side faces of theupper cladding structure constitutes about 90° or less with respect to alower face of the upper cladding structure.

In still another embodiment of the invention, the semiconductor laserdevice satisfies the relationship 0.3 μm<W2-W3<3 μm, where W2 is a widthof the lower face of the cap layer, and W3 is a width of the upper faceof the ridge.

In still another embodiment of the invention, the semiconductor laserdevice satisfies the relationship (W1-W3)/2d1<3, where W1 is a width ofthe upper face of the cap layer; W3 is a width of the upper face of theridge; and d1 is a thickness of the cap layer.

In still another embodiment of the invention, the protection layerincludes at least a first protection layer and a second protectionlayer, which are arranged so that the first protection layer issubstantially interposed between the second protection layer and thecurrent blocking layer, the first protection layer having the firstconductivity type, and the second protection layer having secondconductivity type.

In still another embodiment of the invention, the semiconductor laserdevice satisfies the relationship d2>0.2 μm, wherein d2 is a thicknessof the current blocking layer.

In still another embodiment of the invention, the semiconductor laserdevice satisfies the relationship d2+d3>0.4 μm, wherein d2 is athickness of the current blocking layer; and d3 is a thickness of thefirst protection layer.

In another aspect, the present invention provides a method for producinga semiconductor laser, the method including the steps of: depositing, inthis order, a lower cladding layer having a first conductivity type, anactive layer, an upper cladding structure having a second conductivitytype, and a cap layer having the second conductivity type on asemiconductor substrate having the first conductivity type; forming astripe-shaped first etching protection film on the cap layer, thestripe-shaped first etching protection film functioning as a mask;forming a ridge in the upper cladding structure by etching awaypredetermined regions of the cap layer and the upper cladding structurewhich are not substantially covered by the mask, the ridge having anupper face having a width smaller than a width of a lower face of thecap layer.

In one embodiment of the invention, the upper cladding structure isetched at an etching speed faster than an etching speed for the caplayer during the step of forming a ridge.

In another embodiment of the invention, the step of depositing the uppercladding structure comprises a step of depositing, in this order, afirst upper cladding layer having the second conductivity type, anetching stop layer having the second conductivity type, and a secondupper conductivity type having the second conductivity type; and thestep of forming a ridge having an upper face having a width smaller thana width of a lower face of the cap layer forms the ridge in the secondupper cladding by etching away predetermined regions of the cap layerand the second upper cladding layer of the upper cladding structurewhich are not substantially covered by the mask so as to form a ridge inthe upper cladding structure.

In still another embodiment of the invention, the second upper claddinglayer is etched at an etching speed faster than an etching speed for thecap layer during the step of forming a ridge.

In still another embodiment of the invention, the etching stop layer hasa composition different from a composition of the first upper claddinglayer and a is composition of the second upper cladding layer.

In still another embodiment of the invention, the method furtherincludes, subsequent to the stop of forming a ridge, the steps of:forming, in this order, a current blocking layer having the firstconductivity type and a protection layer so that the current blockinglayer and the protection layer substantially cover the cap layer andside faces of the ridge; forming a second etching protection film inregions other than a uppermost portion of the protection layerprojecting upward above the cap layer; and removing a portion of theprotection layer and the current blocking layer that is formed above thecap layer.

In still another embodiment of the invention, the step of removing aportion of the protection layer and the current blocking layer comprisesa step of selectively removing only the protection layer by an etchingwhich provides a faster etching speed for the protection layer than forthe current blocking layer.

In still another embodiment of the invention, the step of removing aportion of the protection layer and the current blocking layer comprisesa step of, after selectively removing only the protection layer, etchingthe current blocking layer by an etching which provides a substantiallyequal etching speed for both the protection layer and the currentblocking layer.

In still another embodiment of the invention, the step of etching thecurrent blocking layer includes a step of etching the side faces of thecap layer, the current blocking layer in the vicinity of the side facesof the cap layer, and the protection layer.

In still another embodiment of the invention, the active layer has arefractive index larger than a refractive index of the lower claddinglayer and a refractive index of the upper cladding structure, and thecurrent blocking layer has a refractive index smaller than therefractive index of the upper cladding structure.

In still another embodiment of the invention, the upper claddingstructure and the current blocking layer include Al; and the cap layerand the protection layer include zero or more Al, the cap layerincluding less Al than the upper cladding structure, and the protectionlayer including less Al than the current blocking layer.

The semiconductor laser according to the present invention isconstructed so that the width of the cap layer becomes larger than thewidth of the uppermost portion of the upper cladding layer during thefirst stage of crystal growth. As a result, when forming the currentblocking layer and the protection layer(s) in the second stage ofsemiconductor crystal growth using a MOCVD growth method, the thicknessof the portions of the Al-containing current blocking layer adjacent tothe ridge can be reduced. In other words, the exposed portion of theAl-containing current blocking layer (which is susceptible to oxidation)is reduced. Specifically, the area of the side faces of the ridge isincreased so as to relatively reduce the amount of material suppliedalong the ridge side faces, thereby resulting in a relatively slowgrowth rate along the ridge side faces. As a result, the deteriorationin the crystallinity of the contact layer formed through the third stageof crystal growth is confined in only the small regions adjacent to theridge side faces, whereby the driving voltage of the semiconductor laseris prevented from increasing.

In the case where an etching is performed by using HP or the like afterthe second stage of crystal growth, the current blocking layer can bemore effectively prevented from being etched than in conventionaltechniques because of the small width of the portions of the currentblocking layer adjacent to the ridge side faces.

According to the method for producing a semiconductor laser of thepresent invention, the second stage of crystal growth is performedwithout using a dielectric film so that the semiconductor layers areprevented from having dislocations. Moreover, since it is unnecessary toemploy a corrosive gas, it facilitates the management and operation ofthe MOCVD apparatus.

Furthermore, according to the production method of the presentinvention, the current blocking layer (containing a relatively largeamount of Al) and the protection layer(s) (containing a relatively smallamount of Al) are sequentially formed. Next, when removing the layersformed above the ridge, the protection layer(s) is selectively etched,whereafter the remaining layer(s) on the ridge are etched away. Bydividing the etching process into two steps, it becomes possible tocomplete the selective etching of the cap layer and the etching of theother layers in relatively short time periods. As a result, theoccurrence of unsatisfactory products due to excessive or insufficientetching can be reduced.

Thus, the invention described herein makes possible the advantages of(1) providing a low-resistance semiconductor laser device in which thecrystallinity of the contact layer is improved; (2) providing a highlyreliable semiconductor laser in which dislocations are prevented fromoccurring in the active region; and (3) a method for producing suchsemiconductor laser devices.

These and other advantages of the present invention will become apparentto those skilled in the art upon reading and understanding the followingdetailed description with reference to the accompanying figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a semiconductor laser deviceaccording to Example 1 of the present invention.

FIG. 2 is a cross-sectional view showing a semiconductor laser deviceaccording to Example 2 of the present invention.

FIGS. 3A and 3B are cross-sectional views showing a semiconductor laserdevice according to Example 3 of the present invention.

FIG. 4 is a cross-sectional view showing a semiconductor laser deviceaccording to Example 4 of the present invention.

FIG. 5 is a cross-sectional view showing a semiconductor laser deviceaccording to Example 5 of the present invention.

FIGS. 6A to 6J are cross-sectional views illustrating respectiveproduction steps of a semiconductor laser device according to Example 1of the present invention.

FIGS. 7A and 7B are cross-sectional views illustrating production stepsof a semiconductor laser device according to Example 3 of the presentinvention.

FIG. 8 is a cross-sectional view showing a conventional semiconductorlaser device.

FIGS. 9A to 9D are cross-sectional views illustrating production stepsof a conventional semiconductor laser device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, with reference to the accompanying figures, the presentinvention will be described by way of illustrative examples.

EXAMPLE 1

A semiconductor laser according to Example 1 of the present inventionwill be described with reference to FIG. 1.

The semiconductor laser shown in FIG. 1 includes a semiconductormultilayer structure (including a plurality of semiconductor layerswhich are epitaxially grown) formed on an n-GaAs substrate 101(thickness: about 50 μm to about 130 μm).

The semiconductor multilayer structure includes: an n-GaAs buffer layer102 (thickness: about 0.1 μm to about 1.0 μm), an n-Al_(x) Ga_(1-x) Aslower cladding layer 103 (thickness: about 0.5 μm to about 2.0 μm)(0.45≦x≦0.65), an Al_(y) Ga_(1-y) As active layer 104 (thickness: about0.01 μm to about 0.1 μm) (0.07≦y≦0.16), a p-Al_(x) Ga_(1-x) As firstupper cladding layer 105 (thickness: about 0.1 μm to about 0.4 μm)(0.45≦z≦0.65), and a p-GaAs etching stop layer 106 (thickness: about0.002 μm to about 0.004 μm), which are laminated in this order on thesubstrate 101.

Furthermore, the semiconductor multilayer structure includes a p-Al_(u)Ga_(1-u) As second upper cladding layer 107 (thickness: about 0.3 μm toabout 1.5 μm) (0.45≦u≦0.65) having a ridge 113 and a p-GaAs cap layer108 (thickness: about 0.2 μm to about 1.0 μm) above and in the vicinityof the central portion of the p-GaAs etching stop layer 106. The p-GaAscap layer 108 is formed on the second upper cladding layer 107.Moreover, the semiconductor multilayer structure includes an n-Al_(v)Ga_(1-v) As current blocking layer 109 (thickness: about 0.2 μm to about1.0 μm) (0.5≦v≦0.85) and an n-GaAs first protection layer 110(thickness: about 0.2 μm to about 1.0 gm), and a p-GaAs secondprotection layer 111 (thickness: about 0.5 μm to about 1.5 μm) laminatedin this order away from the substrate 101. The layers 109, 110, and 111are formed so as to interpose the second upper cladding layer 107 andthe cap layer 108 on both sides. A p-GaAs contact layer 112 (thickness:about 70 μm) is further formed on the cap layer 108.

Herein, x, y, z, u, and v represent respective component ratios wherev>u and x, z, u>y.

The width of the lower face of the p-GAs cap layer 108 is prescribed ata value larger than the width of the upper face of the p-Al_(u) Ga_(1-u)As second upper cladding layer 107. The width of the lowermost portionof the p-Al_(u) Ga_(1-u) As second upper cladding layer 107 (whichdefines the lowermost portion of the ridge) is prescribed at about 0.5μm to about 5.0 μm. The p-GaAs cap layer 108 is formed in such a mannerthat each side face constitutes an angle of 90° or more with respect tothe bottom face. The p-Al_(u) Ga_(1-u) As second upper cladding layer107 is formed in such a manner that each side face constitutes an angleof 90° or less with respect to the bottom face.

Now, a method for producing the above-mentioned semiconductor lasershown in FIG. 1 is described with reference to FIGS. 6A to 6J.

First, in the first stage of semiconductor layer crystal growth shown inFIG. 6A, the n-GaAs buffer layer 102, the n-Al_(x) Ga_(1-x) As lowercladding layer 103, the Al_(y) Ga_(1-y) As active layer 104, thep-Al_(z) Ga_(1-z) As first upper cladding layer 105, the p-GaAs etchingstop layer 106, the p-Al_(u) Ga_(1-u) As second upper cladding layer107, and the p-GaAs cap layer 108 are grown in this order on the n-GaAssubstrate 101 (by using MOCVD growth technique, for example).

Next, as shown in FIG. 6D, a resist film 114 is formed in a stripedshape (in the (011) orientation) on the p-GaAs cap layer 108 by usingknown photolithography techniques.

Next, as shown in FIG. 6C, the p-GaAs cap layer 108 and the p-Al_(u)Ga_(1-u) As second upper cladding layer 107 are partially etched inregions where the resist film 114 is not formed. This etching process isperformed by a method which provides little selectivity between AlGaAsand GaAs. The etching time is controlled so that a portion of thep-Al_(u) Ga_(1-u) As second upper cladding layer 107 remains on theentire upper face of the p-GaAs etching stop layer 106 withoutcompletely removing the p-Al_(u) Ga_(1-u) As second upper cladding layer107.

The etching method can be, for example, wet etching using a mixture ofH₂ SO₄ :H₂ O₂ :H₂ O=1:8:50 as an etchant. Since this etchant has someanisotropy in the etching speed for GaAs, the p-GaAs cap layer 108 canbe etched into a so-called reversed mesa shape where each side facethereof constitutes an angle of 90° or more with respect to the bottomface thereof, by etching the GaAs in a striped shape along the (011)orientation. Since this etchant has a slightly faster etching speed forAlGaAs than GaAs, the width of the lower face of the p-GaAs cap layer108 can be made larger then the width of the upper face of the p-AlGaAssecond upper cladding layer 107 after the etching.

Next, as shown in FIG. 6D, the p-AlGaAs second upper cladding layer 107is selectively etched by using an etchant which provides a floweretching speed for GaAs than AlGaAs. As a result, the p-Al_(u) Ga_(1-u)As second upper cladding layer 107 is etched away in regions where theresist film 114 is not formed so that the remainder of the p-Al_(u)Ga_(1-u) As second upper cladding layer 107 forms the ridge 113. It isensured that the ridge 113 is shaped so that the width of (both theupper face and the lower face of) the p-GaAs cap layer 108 is largerthan the width of (both the upper face and the lower face of) thep-Al_(u) Ga_(1-u) As second upper cladding layer 107. HF can be suitablyused as the etchant, for example. The resist film 114 is removed afterthis etching process.

Next, in the second stage of semiconductor layer crystal growth shown inFIG. 6E, (after the resist film 114 is removed,) the n-Al_(v) Ga_(1-v)As current blocking layer 109, the n-GaAs first protection layer 110 andthe p-GaAs second protection layer 111 are grown on the entire upperface of the etching stop layer 106 in this order by using MOCVD growthtechniques.

Next, as shown in FIG. 6F, the n-Al_(v) Ga_(1-v) As current blockinglayer 109, the n-GaAs first protection layer 110, and the p-GaAs secondprotection layer 111 are grown in this order so as to entirely cover theridge 113 and the side faces and upper face of the p-GaAs cap layer 108.An etching protection film 115 (consisting of a resist or the like) isformed on the upper face of the p-GaAs second protection layer 111except in the vicinity of the summit of the convex portion of the p-GaAssecond protection layer 111.

Next, as shown in FIG. 6G, the n-GaAs first protection layer 110 and thep-GaAs second protection layer 111 formed above the ridge 113 areselectively etched by using an etchant which provides a slower etchingspeed for AlGaAs than GaAs. As the etchant, NH₄ OH:H₂ O₂ :H₂ O=1:30:50can be used, for example.

Next, as shown in FIG. 6H, portions of the n-Al_(v) Ga_(1-v) As currentblocking layer 109, the n-GaAs first protection layer 110, and thep-GaAs second protection layer 111 located above the ridge 113 and thevicinity thereof are etched so as to obtain a planar face (including theupper face of the p-GaAs cap layer 108), by using an etchant whichprovides little selectivity between AlGaAs and GaAs. As the etchant, H₂SO₄ :H₂ O₂ :H₂ O=1:8:50 can be used, for example.

Next, as shown in FIG. 61, the etching protection layer 115 is removed.

Next, as shown in FIG. 6J, the p-GaAs contact layer 112 is formed overthe entire planar face including the p-GaAs cap layer 108.

After the above-described steps illustrated in FIGS. 6A to 6J, anelectrode is formed on both of the n-GaAs substrate 101 and the p-GaAscontact layer 112, thereby accomplishing the semiconductor laseraccording to Example 1 of the invention (shown in FIG. 1).

Prerequisites for the material composing the etching stop layer 106 arethat: i) the Al content must be smaller than the Al content of thesecond upper cladding layer 107 in order to minimize the oxidation ofthe surface exposed after the formation of the ridge 113; and ii) thelight absorption by the etching layer 106 must be minimum. These are thereasons why many conventional techniques employ a layer containing Al ata component ratio of 0.2 to 0.25 as the etching stop layer. However, theGaAs etching stop layer 106 (having a thickness of e.g., 30 angstroms)employed in Example 1 does not contain any Al and therefore is veryunlikely to be oxidized when exposed to the atmosphere after thep-Al_(u) Ga_(1-u) As second upper cladding layer 107 is removed in thestep of forming the ridge 113. As a result, an excellent crystal can bedeposited upon the GaAs etching stop layer 106 in the subsequent MOCVDstep.

Due to quantum effects, the actual band gap energy of the etching stoplayer 106 is larger than that of the active layer. As a result, theetching stop layer 106 does not absorb the light emitted from the activelayer. Thus, in accordance with Example 1, the etching stop layerdisposed adjacent to the active layer causes substantially nopropagation loss.

In Example 1, the ridge 113 is formed so that the width of the lowerface of the p-GaAs cap layer 108 is larger than the width of the upperface of the p-Al_(u) Ga_(1-u) As second upper layer 107, in contrast toconventional semiconductor lasers. As a result, the thickness of then-Al_(v) Ga_(1-v) As current blocking layer 109 formed on the side facesof the p-GaAs cap layer 108 can be reduced, thereby minimizing the areaof the n-Al_(v) Ga_(1-v) As current blocking layer 109 (containing theoxidation-susceptible Al component) that is exposed on the surface ofthe semiconductor laser. Thus, the deterioration in the crystallinity ofthe contact layer 112 (formed through the third crystal growth) isconfined in only a small region of the current blocking layer 109 thatis exposed on the surface.

Moreover, in Example 1, each side face of the p-GaAs cap layer 108constitutes an angle (α as shown in FIG. 1) of 90° or more with respectto the bottom face thereof. The closer toward the substrate 101 the sidefaces of the p-GaAs cap layer 108 are oriented, the more of the materialprovided on these side faces accumulates on the side faces of thep-Al_(u) Ga_(1-u) As second upper cladding layer 107 and the upper faceof the p-GaAs etching stop layer 106. As a result, less material isprovided on the side faces of the p-GaAs cap layer 108.

Furthermore, in Example 1, each side face of the p-Al_(u) Ga_(1-u) Assecond upper cladding layer 107 constitutes an angle (β as shown inFIG. 1) of 90° or less with respect to the bottom face thereof, therebybringing the side faces of the p-GaAs cap layer 108 closer to the sidefaces of the p-Al_(u) Ga_(1-u) As second upper cladding layer 107 thanin the case where the angle exceeds 90°. As a result, more material isprovided along the side faces of the p-Al_(u) Ga_(1-u) As second uppercladding layer 107 while less material is provided along the side facesof the p-GaAs cap layer 108, thereby allowing a minimum area of theAl-containing layer to be exposed on the surface. As a result, thedeterioration in the crystallinity of the contact layer 112 is reduced,thereby effectively reducing the driving voltage of the semiconductorlaser.

In order to obtain the aforementioned effects, it is preferable that thewidth W2 of the lowermost portion of the p-GaAs cap layer 108 and thewidth W3 of the topmost (summit) portion of the convex ridge of thesecond upper cladding layer 107 satisfy the relationship 0.3 μm<W2-W3<3μm.

In Example 1, the width of the n-Al_(v) Ga_(1-v) As current blockinglayer 109 formed on the side faces of the p-GaAs cap layer 108 istypically in the range of about 0.05 μm to about 0.35 μm althoughsusceptible to slight variation. Such a thickness accounts for about 60%or less of about 0.6 μm, which is the thickness of the n-Al_(v) Ga_(1-v)As current blocking layer 109 formed in regions other than the ridge 113(a region other than the portions which are in contact with the sidefaces of the ridge 113). The width of the portions of the n-Al_(v)Ga_(1-v) As current blocking layer 109 formed on the side faces of thep-GaAs cap layer 108 is preferably about 0.4 μm or less.

The width W1 of the upper face of the p-GaAs cap layer 108, thethickness d1, and the width W3 of the upper face of the p-Al_(u)Ga_(1-u) As second upper cladding layer 107 must satisfy therelationship (W1-W3)/2d1<3. The value of (W1-W3)/2d1 indicates theextent of the p-GaAs cap layer 108 projecting over the upper face of thep-AlGaAs second upper cladding layer 107. Specifically, the p-GaAs caplayer 108 projects more drastically over the upper face of the p-Al_(u)Ga_(1-u) As second upper cladding layer 107 as the value (W1-W3)/2d1increases. If the value (W1-W3)/2d1 exceeds about 3, the projection ofthe p-GaAs cap layer 108 becomes excessive and makes itself vulnerable,e.g., by breaking off. Therefore, the value (W1-W3)/2d1 must be lessthan about 3, and more preferably about 2.5 or less.

The production method according to Example 1 does not employ anydielectric films for the second crystal growth as in the case of typeconventional example described above. As a result, the semiconductorlayers are prevented from having strain as in the case of theconventional example, thereby providing a highly reliable semiconductorlaser.

In Example 1, the n-Al_(v) Ga_(1-v) As current blocking layer 109, then-GaAs first protection layer 110, and the p-GaAs second protectionlayer 111, which are formed so As to cover the ridge 113, are removed byfirst selectively etching the n-GaAs first protection layer 110 and thep-GaAs second protection layer 111 (FIG. 6G) and then etching then-Al_(v) Ga_(1-v) As current blocking layer 109 (FIG. 6H). By etchingthe layers 109, 110, and 111 in two steps, it becomes possible tocomplete the selective etching of the p-GaAs cap layer 108 (FIG. 6C) andthe etching of the other layers in relatively short time periods (ascompared with the etching time required for etching the three layers109, 110, and 111 at the same time), thereby reducing the occurrence ofunsatisfactory products due to excessive or insufficient etching.

Furthermore, the process of partially etching the current blocking layer109 is performed by employing an etchant which provides littleselectivity and controlling the etching time. On the contrary, if HF orthe like is used for selectively etching the n-Al_(v) Ga_(1-v) Ascurrent blocking layer 109 above the ridge 113, minute holes may becreated adjacent to the p-GaAs cap layer 108. Since the p-GaAs secondprotection layer 111 and the n-GaAs first protection layer 110 arealready removed by etching (FIG. 6G), the non-selective etching processcan be completed in a short time, so that the occurrence ofunsatisfactory products due to excessive or insufficient etching isminimized according to Example 1.

The n-Al_(v) Ga_(1-v) As current blocking layer 109, the n-GaAs firstprotection layer 110, the p-GaAs second protection layer 111 interposeboth side faces of the ridge 113. (Hereinafter, these three layers willbe collectively referred to as a "current blocking structure"). Thesemiconductor laser of Example 1 adopts the current blocking structurein order to reduce the etching time for the current blocking layer 109alone. In other words, the current blocking structure includes twon-layers and one p-layer, i.e., the n-GaAs first protection layer 110and the p-GaAs second protection layer 111, so as to make it possible tosecurely block the electric current flowing within the layers interposedtherebetween without overly increasing the thickness of the n-Al_(v)Ga_(1-v) As current blocking layer 109.

The thickness of the n-Al_(v) Ga_(1-v) As current blocking layer 109should be minimized. However, if the n-Al_(v) Ga_(1-v) As currentblocking layer 109 is too thin, the n-GaAs first protection layer 110may absorb some light. The thickness d2 of the n-Al_(v) Ga_(1-v) Ascurrent blocking layer 109 must be larger than at least about 0.2 μm inorder to achieve propagation based on the actual refractive index guide.More preferably, d2 is larger than at least about 0.3 μm in order tosecurely prevent light absorption in the n-GaAs first protection layer110 located on the n-Al_(v) Ga_(1-v) As current blocking layer 109.

If the total of the thicknesses of the n-Al_(v) Ga_(1-v) As currentblocking layer 109 and the n-GaAs first protection layer 110 is toolarge, the diffusion of a dopant through these n-layers may be enhancedso that the p-Al_(z) Ga_(1-z) As first upper cladding layer may have then-conductivity type. On the other hand, if the total thickness of then-layers is too small, the n-layers may break down at the time ofcurrent injection or the p-type dopant diffused from the above and belowp-layers may impart the layers with the p-type conductivity, possiblyresulting in a current leakage. In order to avoid this problem, it ispreferable that the thickness d3 of the n-GaAs first protection layer110 satisfy the relationship d2+d3>0.4 μm in order to prevent currentleakage. More preferably, the thickness d3 of the n-GaAs firstprotection layer 110 satisfies the relationship d2+d3>0.6 μm. In Example1, the n-Al_(v) Ga_(1-v) As current blocking layer 109 and the n-GaAsfirst protection layer 110 are formed in greater thicknesses thannecessary.

In Example 1, the partial etching of the p-GaAs cap layer 108 and thep-Al_(u) Ga_(1-u) As second upper cladding layer 107 is achieved by wetetching using an etchant containing H₂ SO₄ :H₂ O₂ :H₂ O at 1:8:50 (FIG.6C). This etching is timed so that the p-Al_(u) Ga_(1-u) As second uppercladding layer 107 is not entirely removed but rather remains over theentire upper face of the p-GaAs etching stop layer 106.

As an alternative method for this etching step, the p-GaAs cap layer 108can be selectively etched by using an etchant which provides a slowetching speed for AlGaAs, e.g., an atchant containing NH₄ OH:H₂ O₂ :H₂ Oat 1:30:50 ("Method A"). In this case, this etching step may beterminated once the p-GaAs cap layer 108 is etched, without etching thep-AlGaAs second upper cladding layer 107. Subsequently, it is alsopossible to partially etch the p-GaAs cap layer 108 and the p-Al_(u)Ga_(1-u) As second upper cladding layer 107 by an etching method whichprovides little selectivity between AlGaAS and GaAs to form the shapeshown in FIG. 6C. (Method B)

The advantage of Method A (selective etching) is that it is easy tocontrol the etching. The disadvantage is that, since the p-Al_(u)Ga_(1-u) As second upper cladding layer 107 is left without being etchedat all, the subsequent etching step with HF may need to be performed fora long time.

The advantage of Method B is that the etching is performed in two stepsso that the etching time with the etchant containing H₂ SO₄ :H₂ O₂ :H₂ Oat 1:8:50 can be reduced. The disadvantage is that the increased numberof etching steps, which slightly complicates the production process.

In an alternative method to the method of Example 1, it is possible toetch the portion of the n-Al_(v) Ga_(1-v) As current blocking layer 109present above the ridge 113. In this case, too, the n-Al_(v) Ga_(1-v) Ascurrent blocking layer 109 has a very small width on each side of thep-GaAs cap layer 108 and therefore is less likely to be etched than inthe conventional example.

The p-GaAs contact layer 112 can be grown on the plane includingthe-p-GaAs cap layer 108 by either MOCVD, MBE (molecular beam epitaxy),or LPE (liquid phase epitaxy). Any of the above methods can grow anexcellent contact layer 112 because the n-Al_(v) Ga_(1-v) As currentblocking layer 109 has a very small width on each side of the p-GaAs caplayer 108. The structure of Example 1 is particularly effective for theLPE growth method, in which it is relatively difficult to grow crystalon AlGaAs. The structure of Example 1 is also particularly advantageousdue to the small width of n-Al_(v) Ga_(1-v) As current blocking layer109 on each side of the p-GaAs cap layer 108 in the case whereelectrodes are provided on the semiconductor laser without forming thep-GaAs contact layer 112 because the adhesion between the electrodes andAlGaAs is relatively weak.

The cap layer 108, the first protection layer 110, and the secondprotection layer 111 can contain Al. For example, these layers can bemade of AlGaAs.

EXAMPLE 2

With reference to FIG. 2, a semiconductor laser according to Example 2of the present invention will be described.

The semiconductor laser according to Example 2 has the same structure asthat of the semiconductor laser according to Example 1 except for theshapes of the pGaAs cap layer 108 and the p-Al_(u) Ga_(1-u) As secondupper cladding layer 107.

The p-GaAs cap layer 108 has a reversed mesa shape. Each side face ofthe p-GaAs cap layer 108 is composed of two portions, the lower portion(indicated at a) in FIG. 2) being formed closer to the horizontaldirection, As a result, the thicknesses of the portions of the n-Al_(v)Ga_(1-v) As current blocking layer 109 adjacent to the side faces of thep-GaAs cap layer 108 can be further reduced. In order to obtain thisstructure, the etching time using the etchant containing H₂ SO₄ :H₂ O₂:H₂ O at 1:8:50 in the step of removing portions of the p-GaAs cap layer108 and the n-Al_(v) Ga_(1-v) As current blocking layer 109 is increasedas compared with Example 1. Thus, each corner indicated at a) in FIG. 6Cis etched to form a new lower portion of the side face.

The p-Al_(u) Ga_(1-u) As second upper cladding layer 107 is formed so asto have curved side faces as shown at b) in FIG. 2. By adopting thisstructure, the distribution of a carrier which is injected into theemission region of the active layer immediately under the ridge 113becomes similar to the distribution of light, thereby improving theemission efficiency. In order to obtain this structure, the etching timewith HF during the step of partially etching away the second uppercladding layer 107 is adapted so that the etching time for the sidefaces of the ridge 113 alone, performed after removing the p-Al_(u)Ga_(1-u) As second upper cladding layer 107 in regions other than theridge 113, is reduced as compared with Example 1. As a result, the shapeof the ridge 113 obtained from the previous step is adequatelyconserved. The lowermost portion of each curved side face of thep-Al_(u) Ga_(1-u) As second upper cladding layer 107 is preferably notso curved that it is asymptotic to the p-GaAs etching stop layer 106 (inwhich case the carrier distribution would be overly dispersed and lost).Therefore, it is preferable that the lowermost portion of each curvedside face of the p-Al_(u) Ga_(1-u) As second upper cladding layer 107constitutes a sufficient angle with respect to the p-GaAs etching stoplayer 106.

The cap layer 108, the first protection layer 110, and the secondprotection layer 111 can contain Al. For example, these layers can bemade of AlGaAs.

EXAMPLE 3

With reference to FIGS. 3A and 3B, a semiconductor laser according toExample 3 of the present invention will be described.

The semiconductor laser according to Example 3 has the same structure asthat of the semiconductor laser according to Example 2 except that theside faces of the p-GaAs cap layer 108 as well as portions of then-AlGaAs current blocking layer 109, the n-type first protection layer110, and the p-GaAs second protection layer 111 in the vicinity of theside faces of the p-GaAs cap layer 108 are etched inma concave shape,upon which the p-GaAs contact layer 112 is formed. FIG. 3A illustratesthe case where the p-contact layer 112 is formed by LPE growth. FIG. 3Billustrates the case where the p-contact layer 112 is formed by MOCVDgrowth.

In order to obtain this structure, the step of selectively removing thefirst and second protection layers 110 and 111, the n-GaAs firstprotection layer 110 and the p-GaAs second protection layer 111 must beetched longer than in Example 2. By the increased etching time, a largegap is obtained on each side between the n-Al_(v) Ga_(1-v) As currentblocking layer 109 and the first and second protection layers 110 and111 (FIG. 7A). Next, the n-Al_(v) Ga_(1-v) As current blocking layer 109on the ridge 113 is removed by an etchant which provides littleselectivity between AlGaAs and GaAs. As a result, the side faces andadjacent areas of the p-GaAs cap layer 108 are etched in concave shapes,reflecting the previously formed large gaps (FIG. 7B). Finally, afterthe etching protection film 115 is removed, the p-GaAs contact layer 116is formed over the entire surface, including the concave grooveportions.

In Example 3, concave grooves are formed including the portions of then-Al_(v) Ga_(1-v) As current blocking layer 109 that are exposed on thesurface, upon which the p-GaAs contact layer 112 is grown. In general,when forming a concave groove on a flat substrate and growing a crystalthereon, the crystal growth in the groove is more enhanced so that thesurface of the substrate becomes planar over time. Due to this effect,the crystal growth on the n-Al_(v) Ga_(1-v) As current blocking layer109 is enhanced to further minimize the deterioration in crystallinity.

By adopting the structure in which the concave grooves are filled or atleast covered with the p-GaAs contact layer 112, the side faces of thep-GaAs cap layer 108 (note that it has p-conductivity) are electricallyconnected to the p-GaAs. second protection layer 111. As a result, thep-GaAs cap layer 108 does not confine electric currents, so that theresistance of the p-GaAs cap layer 108 can be drastically reduced.

The cap layer 108, the first protection layer 110, and the secondprotection layer 111 can contain Al. For example, these layers can bemade of AlGaAs.

EXAMPLE 4

With reference to FIG. 4, a semiconductor laser according to Example 4of the present invention will be described.

The semiconductor laser according to Example 4 has the same structure asthat of the semiconductor laser according to Example 1 except that onlytwo layers, i.e., an n-Al_(v) Ga_(1-v) As current blocking layer 109(thickness: about 0.2 μm to about 1.0 μm) and a p-GaAs protection layer120 (thickness: about 0.5 μm to about 1.5 μm), are disposed on theoutside of the ridge 113. In order to prevent current leakage, thedoping amount of the p-GaAs protection layer 120 is reduced to about1.0E+18cm⁻³ or less. The structure of Example 4 provides the sameoverall characteristics as the structures of Examples 1 and 2. However,the structure of Example 4 may be less advantageous than the structuresof Examples 1 and 2 in that the p-type conductivity may be erroneouslyimparted for the n-Al_(v) Ga_(1-v) As current blocking layer 109 due toa slight variation of the growth conditions for the crystal. This isbecause a p-type dopant may diffuse to the n-Al_(v) Ga_(1-v) As currentblocking layer 109 to cause some current leakage.

The cap layer 108 and the protection layer 120 can contain Al. Forexample, these layers can be made of AlGaAs.

EXAMPLE 5

With reference to FIG. 5, a semiconductor laser according to Example 5of the present invention will be described.

Unlike the aforementioned Examples of the invention, the semiconductorlaser according to Example 5 does not include the p-GaAs etching stoplayer 106. That is, the p-Al_(z) Ga_(1-z) As first upper cladding layer105, the p-GaAs etching stop layer 106, and the p-Al_(u) Ga_(1-u) Assecond upper cladding layer 107 are replaced by a p-AlGaAs uppercladding structure 121. Furthermore, the p-type cap layer 108 has acomposition represented as Al_(a) Ga_(1-a) As (thickness: about 0.2 μmto about 1.0 μm; a ≦0.4). The n-type first protection layer 110 has acomposition represented as Al_(b) Ga_(1-b) As (thickness: about 0.2 μmto about 1.0 μm; b ≦0.4). The p-type second protection layer 111 has acomposition represented as Al_(c) Ga_(1-c) As (thickness: about 0.5 μmto about 1.5 μm; c ≦0.4). It should be noted that the cap layer 108, thefirst protection layer 110, and the second protection layer 111 may ormay not include Al. Moreover, the p-Al_(a) Ga_(1-a) As cap layer 108does not have a reversed mesa shape.

The production method for the semiconductor laser of Example 5 differsfrom the production method for the semiconductor laser of Example 1 inthat the step of partially etching the cap layer and the second uppercladding layer and the step of selectively removing the second uppercladding layer are performed by dry etching. In particular, the step ofselectively removing the second upper cladding layer is time-controlledin order to achieve the desired etching because of the lack of etchingstop layers (unlike in Example 1). Since the Al_(a) Ga_(1-a) As caplayer 108 does not have a reversed mesa shape, the thickness of then-Al_(v) Ga_(1-v) As current blocking layer 109 adjacent to the sidefaces of the p-Al_(a) Ga_(1-a) As cap layer 108 increases as comparedwith Examples 1, 2, and 3, but the thickness is nonetheless smaller thanin the conventional example so that the problem inherent in theconventional structure is effectively solved.

Even in the case where a dielectric film like that used in theconventional example is employed, the structures of Examples 1 to 5 ofthe present invention are effective over the conventional structure forpreventing the n-Al_(v) Ga_(1-v) As current blocking layer 109 frombeing etched at the time of removing the dielectric film with HF and thelike.

As described above, in accordance with the present invention, thecrystallinity of the contact layer 112 can be improved so that alow-resistance semiconductor laser can be provided.

By employing the production method according to the present invention,dislocations are prevented from occurring in the active region. As aresult, a highly reliable semiconductor laser can be produced.

Although the above-described Examples only illustrated an AlGaAsmaterial system, it will be appreciated by those skilled in the art thatany other material system that does not contradict or hinder theprinciple of the present invention, e.g., InGaAl, can alternatively beused.

Various other modifications will be apparent to and can be readily madeby those skilled in the art without departing from the scope and spiritof this invention. Accordingly, it is not intended that the scope of theclaims appended hereto be limited to the description as set forthherein, but rather that the claims be broadly construed.

What is claimed is:
 1. A method for producing a semiconductor lasercomprising the steps of:depositing, in this order, a lower claddinglayer having a first conductivity type, an active layer, an uppercladding structure having a second conductivity type, and a cap layerhaving the second conductivity type on a semiconductor substrate havingthe first conductivity type; forming a stripe-shaped first etchingprotection film on the cap layer, the stripe-shaped first etchingprotection film functioning as a mask; forming a ridge in the uppercladding structure by etching away regions of the cap layer and theupper cladding structure which are not substantially covered by themask, the ridge having an upper face having a width smaller than a widthof a lower face of the cap layer; forming a current blocking layerhaving the first conductivity type and a protection layer so that thecurrent blocking layer and the protection layer substantially cover thecap layer and side faces of the ridge; forming a second etchingprotection film in regions other than a uppermost portion of theprotection layer projecting upward above the cap layer; and removing aportion of the protection layer and the current blocking layer that isformed above the cap layer.
 2. A method according to claim 1, whereinthe step of removing a portion of the protection layer and the currentblocking layer comprises a step of selectively removing only theprotection layer by an etching which provides a faster etching speed forthe protection layer than for the current blocking layer.
 3. A methodaccording to claim 2, wherein the step of removing a portion of theprotection layer and the current blocking layer comprises a step of,after selectively removing only the protection layer, etching thecurrent blocking layer by an etching which provides a substantiallyequal etching speed for both the protection layer and the currentblocking layer.
 4. A method according to claim 3, whereinthe step ofetching the current blocking layer comprises a step of etching the sidefaces of the cap layer, the current blocking layer in the vicinity ofthe side faces of the cap layer, and the protection layer.
 5. A methodaccording to claim 1, whereinthe active layer has a refractive indexlarger than a refractive index of the lower cladding layer and arefractive index of the upper cladding structure, and the currentblocking layer has a refractive index smaller than the refractive indexof the upper cladding structure.
 6. A method according to claim 1,whereinthe upper cladding structure* and the current blocking layerinclude Al; and the cap layer and the protection layer include zero ormore Al, the cap layer including less Al than the upper claddingstructure, and the protection layer including less Al than the currentblocking layer.